18 May 2004
PRESS RELEASE
 

Helic Joins the Cadence Connections Program
 

ATHENS, GREECE - Helic S.A. proudly announces that the company has joined the Cadence® Connections® program as an Emerging Solutions member. Through its membership, Helic will assure that the rapid modeling capabilities of its VeloceRF™ design tool work seamlessly with the Cadence Virtuoso® custom design platform. VeloceRF helps designers to accelerate the development of complex RFICs and systems-in-package by enabling rapid, whole-chip electromagnetic modeling early in the design flow.

"With rapid synthesis, modeling and simulation of spiral inductive components inside the Virtuoso platform, our customers slash their RFIC development time, expand design capabilities and add significant value to their investment in Cadence tools," said Dr. Yorgos Koutsoyannopoulos, Helic CEO.

Kelly Perey, vice president of marketing for the Cadence Virtuoso custom design platform, commented, "The Helic product and IP extend the Virtuoso platform in the area of RF design. VeloceRF provides top-down, schematic-based synthesis and modeling for spiral inductive components that complement our AssuraRF post-layout, signoff analysis tool."

Cadence Emerging Solutions members benefit from dedicated resources that help them implement the optimal mechanism for integration and interfacing to Cadence industry-leading design platforms. Cadence customers benefit from the integration of VeloceRF in the Virtuoso platform by gaining the ability to rapidly create instance-based pcell inductors, or other arbitrary shapes, for more accurate simulations before layout. VeloceRF uses Cadence Assura™ rule files and is well integrated into the Cadence tools. This will enable RFIC designers to be more efficient making their design choices.

VeloceRF is currently available as a module within the Cadence Virtuoso platform, for Solaris®, Linux and HP-UX® operating systems.

About the Cadence Connections Program
The Cadence Connections program promotes open interoperability in all areas of electronic design including digital, custom IC, analog/mixed-signal, and PCB design. By attracting best-in-class members, Cadence offers the industry's largest collection of third-party solutions operating fully with the Cadence suite of design tools. The Connections program has over 120 member companies working toward developing an optimized silicon design chain for customers. Information about the Connections program may be found at http://www.cadence.com/partners/connections/.

About Helic
Helic S.A. specializes in the development of disruptive EDA technologies and multi-standard silicon RF IP for wireless applications. Helic uniquely combines design tools and reconfigurable RF intellectual property (IP) to revolutionize the development of highly-integrated ICs and modules for multi-standard wireless applications. VeloceRF™ is a design tool that enables rapid, whole-chip RF modeling for RFICs and systems-in-package, introducing a radically new inductance-aware design flow. PolyRadio™ is a mix of novel RF IP blocks, enabling the integration of multiple wireless transceivers on a single piece of silicon.

Editorial Contact:
Nikolas Provatas
T: +30 2109949390
E: N.Provatas@helic.com