Technical Advisory Board

Technical Advisory Board



Magdy is an internationally recognized EDA and design technology expert. Elected an IEEE fellow for contributions to the test and verification of microprocessors, Magdy has 10 patents issued with several more filed. He founded and chaired a series of workshops on microprocessor test and verification and on the economics of design, test, and manufacturing. Magdy published over 300 technical papers, with four receiving best paper awards. Previously, Magdy was group manager for EDA tools and methodology at Motorola’s high-performance design group. At Freescale, he managed EDA and IP relationships and helped shape strategic goals. An adjunct faculty at the University of Texas at Austin, Magdy holds a Ph.D. in Electrical Engineering from the University of Southern California.


Stefanos has over two decades of experience in the semiconductor industry. He co-founded Aeluros, a fabless semiconductor company that pioneered the use of CMOS ICs in the optical Ethernet market until its acquisition by Netlogic. He remained at Netlogic as VP of the physical layer products division until the company’s acquisition by Broadcom, where he joined Broadcom’s infrastructure networking group. Stefanos has also worked in R&D and management positions at companies such as Rambus, MIPS, DEC, and 8×8. He’s published papers and was awarded patents in areas ranging from analog circuit design to networking algorithms and memory systems. Stefanos holds a Master’s in Computer Science from the University of Crete and a PhD degree in Electrical Engineering from Stanford.


Aristotele Hadjichristos is an RFIC hands-on expert with 25-year experience in all aspects of RFIC and RF Front-End mobile product design and development. As Senior Director for 12 years at Qualcomm he managed a team of 60 designers and delivered very innovative CMOS cellular RF products. The RTR6285 2G/3G CMOS 0.18u RF transceiver had best in class current consumption and state of the art integration at that time. The RTR8600 3G/4G CMOS 65nm RF transceiver that followed had best in class integration and included every possible band at the time. Both products combined shipped more than 2B units. He also led the first generation of QCT’s RF Front-End products co-driving the creation of Qualcomm’s RF Front End business. Aristotele also worked for 2.5 years at NXP as Senior Director of R&D, leading an international team of 50 engineers and developing mobile power and mixed signal products for top tier mobile OEMs. Previously he was with Ericsson Mobile Platforms for 8 years where he designed IP for GSM products and led the development of the E150 Edge RF platform, which was the first product in the industry to enable the use of polar modulation in handsets (lower cost and longer battery life). Aristotele started his career in the aerospace industry as an RF designer in Italy. He currently holds more than 150 US and international patents and has authored several IEEE papers.


Professor Yehea Ismail is an international recognized and highly accomplished academic researcher with over 20 years of diverse experience in IC design. He is the director of the Nanoelectronics and Devices Center at the American University in Cairo and Zewail City.
After working for IBM, he became tenured professor with Northwestern University, USA (2000-2011). Professor Ismail was the Chief Scientist of the Innovation and Entrepreneurship Center of Egypt’s Ministry of Communications and Information Technology. He also served as chair elect of the IEEE VLSI technical committee and also chaired many conferences such as GLSVLSI, IWSOC, and ISCAS. He is the distinguished lecturer of IEEE CASS and an IEEE Fellow. Additionally, Professor Ismail served as Editor-in-Chief of the IEEE Transaction on Very Large Scale Integration (TVLSI) during 2011-2015, is on the editorial board of the Journal of Circuits, Systems, and Computers, was on the editorial board of the IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications, and a guest editor for a special issue of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems on “On-Chip Inductance in High Speed Integrated Circuits”.
He received several awards such as the USA National Science Foundation Career Award, the IEEE CAS Outstanding Author Award, Best Teacher Award at Northwestern University, and many other best teaching awards and best paper awards. Professor Ismail has published more than 400 papers in top refereed journals and conferences and many patents. He co-authored seven books including: On-Chip Inductance in High Speed Integrated Circuits, Handbook on Algorithms for VLSI Physical Design, Temperature-Aware Computer Architecture, Arbitrary Modeling of TSVs for 3D Integrated Circuits, and Circuit Design Techniques for Microscale Energy Harvesting Systems. He has many patents in the area of high performance circuits and interconnect design and modeling. His work is some of the most highly cited in the VLSI area and is extensively used by industry. Professor Ismail holds a PhD from the University of Rochester.