VeloceWired is a powerful package design tool providing rapid bondwire creation and extraction. With VeloceWired bondwire design becomes an integral part of the IC tool flow.
VeloceWired incorporates several attractive features such as :
• Accurate, broadband modeling of bondwire arrays.
• Seamless integration in Cadence Virtuoso® flow.
• Automatic annotation of parasitic inductances per wire.
• Supports a wide variety of bondwire profiles (JEDEC types and user-defined).
• Supports single-die, multi-die, stacked-die configurations.
• Automatic import of DXF package designs
• 3D view of die, package and bondwire interconnects
• Offers full integration with Helic VeloceRF™ (co-design of on-chip and off-chip inductors).
The latest VeloceWired version (v1.5.5.3) supports the model extraction option of specific bondwires, defined by the designer. In this way a reduced netlist can be generated, where only the bondwires of interest are involved.