Helic

Hi

I have a case of two dies that must be bonded in the same package. Also there are a lot of downbonding wires. Can i use VeloceWired for such an application?

Thanks

Hi vlsi

You can easily use VeloceWired for multi-die or even for stacked-die applications. You just have to import the two dies (you need the die outline and the pad positions) and the package artwork and start drawing the bondwires.

Any bondwire between the dies and the package or between the two dies can be drawn by a simple two click procedure. Downnbonding wires can also be designed using the same methodology.