Bondwires are a popular and low-cost assembly option for a wide range of IC packages. In high-speed IC design, bondwires introduce parasitics such as inductance and magnetic coupling which may affect product performance significantly. To meet demanding requirements, IC designers now have the ability to draw, model and optimize bondwires as parts of their circuits. Package design and IC design, two traditionally isolated processes, have now become seamlessly integrated in an automated design flow.
