SAN FRANCISCO, CA and OSAKA, Japan May 31, 2011 — Helic, Inc., the technology leader in EDA solutions for RF and high-speed IC design and SHARP CORP., proudly announce that SHARP selected Helic’s VeloceRF™, VeloceRaptor/X™ and VeloceWired® to be part of their RFIC design flow.
To meet the demands of RF and high-speed design in advanced silicon processes, VeloceRF™ features a unique component-synthesis engine that generates DRC and DFM-correct inductive devices according to designer specifications. VeloceRF™ brings a complete solution for achieving an optimal floor plan, enabling silicon area reduction by optimizing inductor sizes. The tool de-risks the design from electromagnetic effects, incorporating EM coupling parasitics in post-layout simulation. VeloceRaptor/X™ is a breakthrough RLCK modeling tool with unparalleled capacity and speed suitable for integrated passives such as transmission lines, interconnects, digital high-speed lines, spiral inductive devices and MIM/MOM capacitors. VeloceWired® completes the flow with the design and extraction of 3D structures like bondwires providing instantly the impact of package parasitics on RFIC performance.
Dr. Kunihiko Iizuka, Design Manager at Electronic Components and Devices Group at SHARP, commented on how Helic’s EDA products were instrumental for the successful development of a silicon Low Noise Block-down converter (LNB) designed in a challenging CMOS process. “VeloceRF and VeloceRaptor/X™ helped us to optimize our floor plan and design with high speed and accuracy, while with VeloceWired® we managed to design an optimum input-matching network for our LNA block. The results lead to successful mass production of a silicon LNB with the first parts shipping to customers in April 2011.”
“SHARP leverages its leadership in RF devices to foray the satellite market and we are very proud to contribute with our tools in this endeavor, setting higher standards to address their design needs”, said Yorgos Koutsoyannopoulos, CEO of Helic.
Helic, Inc. develops disruptive EDA technologies for RFIC and high-speed SoC design. We provide our customers with a comprehensive offering combining design tools, silicon IP and applications support, greatly reducing the development cycles of chips for wireless communications, broadband networking, PCs, tablets and other segments. We provide technology for rapid electromagnetics modeling, RF component synthesis, and signal integrity of silicon ICs and Systems-in-Package. Our solutions have been adopted by several major semiconductor companies since 2000.
Helic is headquartered at 101 Montgomery Street, suite 2650, San Francisco, CA 94104.