Helic was founded with a unique portfolio of technologies for the electromagnetic modeling of on-chip passive devices, and the rapid design of RF silicon blocks employing passives. The core of these technologies, a versatile on-chip inductance modeler was enhanced with design automation features to efficiently tackle issues known to impede or inhibit RF silicon integration, such as:

  • Minimization of silicon real estate employed by on-chip inductors and passives.
  • Centering of challenging RF designs such as wideband amplifiers and oscillators.
  • Accurate design of passive on-chip impedance matching circuitry.
  • Concurrent low-noise/low-power receiver block optimization.

In accordance to the vision of its founders for a ubiquitously-connected wireless world, the application focus of Helic’s design innovations was placed on the emerging field of multi-mode, multi-band digital wireless. PolyRadio™, conceived at the early days of the company entails an adaptable direct conversion transceiver architecture that can support both WLAN and WAN standards, such as IEEE 802.11, 3GSM GPRS and UMTS. PolyRadio manages to incorporate multiple wireless bands on a single silicon die, while keeping the external component count and system costs at low levels.

Helic is also pioneering in EDA technologies and design IP for system-in-package radio modules. Advanced substrate/packaging materials such as LTCC can complement and enhance a silicon-based radio, making it possible to integrate high-quality passives and devices such as filters, baluns, couplers and others. Helic creates tools and reference designs that raise the integration level and functionality of RF systems-in-package.