Vector-based lumped-element (RLCK) modeling of conductor microstrips. Support for substrate and dielectric losses, conductor skin effect, metal track stacking.
ASCII-type file containing metal, dielectric and substrate thickness and resistivity parameters (typical, min, max). No parameter fitting or pre-processing required.
High Inductance, Low Inductance, Best Case Losses, Worst Case Losses.
Any SPICE-type simulator.
